Featured Research

from universities, journals, and other organizations

3-D integrated DRAM-on-logic for low-power mobile applications demonstrated

Date:
July 12, 2011
Source:
Interuniversity Microelectronics Centre (IMEC)
Summary:
Researchers in Belgium have demonstrated the potential of 3-D integration of a commercial DRAM chip on top of a logic IC for next-generation low-power mobile applications.

Logic IC stacked on DRAM IC, connected using TSVs and microbumps.
Credit: Image courtesy of Imec

Imec and its 3-D integration partners have demonstrated the potential of 3-D integration of a commercial DRAM chip on top of a logic IC for next-generation low-power mobile applications. Imec's applied 3-D EDA (electronic design automation) tools including thermal models have proven to be valuable means to design next-generation 3-D stacked ICs.

The 3-D stack resembles as close as possible to future commercial chips. It consists of imec's proprietary logic CMOS IC on top of which a commercial DRAM is stacked using through-silicon vias (TSVs) and micro-bumps. Heaters were integrated to test the impact of hotspot on DRAM refresh times. And, the chip contains test structures for monitoring thermo-mechanical stress in a 3-D stack, ESD (electro-static discharge) hazards, electrical characteristics of TSVs and micro-bumps, fault models for TSVs, etc.

Imec's 3-D integrated DRAM-on-logic demonstrator showed that a minimum die thickness of 50m is required to deal with local hot spots on the logic die, which are generated by local power dissipation. Due to the strongly reduced lateral heat spreading capability of thin die, these hot spots are higher in temperature and more confined if the die thickness is reduced.

The hot spots on the logic die cause local temperature increases in the memory die. This may cause a reduction in retention time of the DRAM devices. However, imec's 3-D stacked demonstrator has proven that the DRAM may not be thermally isolated from the logic die since the DRAM die also acts as an effective heat spreader for the logic die. As such the intensity of the hot spot is reduced and thereby the temperature rise in the DRAM device is strongly limited.

The results of the various experiments allowed us to calibrate our thermal models which are implemented in 3-D EDA tools. They have proven to be valuable means to design next-generation 3-D stacked ICs. The design of the 3-D chip is realized together with many players in the 3-D integration supply chain.

"We are excited to achieve this milestone in collaboration with our 3-D integration partners including memory suppliers and IC manufacturers. This test-chip and our 3-D design tools and thermal models are an important step for the introduction of 3-D technology in DRAM-on-logic for mobile applications;" said Luc Van den hove, president and CEO imec. "To boost the performance towards high-end applications, imec will set up a cooling research program."


Story Source:

The above story is based on materials provided by Interuniversity Microelectronics Centre (IMEC). Note: Materials may be edited for content and length.


Cite This Page:

Interuniversity Microelectronics Centre (IMEC). "3-D integrated DRAM-on-logic for low-power mobile applications demonstrated." ScienceDaily. ScienceDaily, 12 July 2011. <www.sciencedaily.com/releases/2011/07/110712093631.htm>.
Interuniversity Microelectronics Centre (IMEC). (2011, July 12). 3-D integrated DRAM-on-logic for low-power mobile applications demonstrated. ScienceDaily. Retrieved September 30, 2014 from www.sciencedaily.com/releases/2011/07/110712093631.htm
Interuniversity Microelectronics Centre (IMEC). "3-D integrated DRAM-on-logic for low-power mobile applications demonstrated." ScienceDaily. www.sciencedaily.com/releases/2011/07/110712093631.htm (accessed September 30, 2014).

Share This



More Computers & Math News

Tuesday, September 30, 2014

Featured Research

from universities, journals, and other organizations


Featured Videos

from AP, Reuters, AFP, and other news services

Apple Releases 'Shellshock' Fix Despite Few Affected Users

Apple Releases 'Shellshock' Fix Despite Few Affected Users

Newsy (Sep. 29, 2014) Apple released a security fix for the "Shellshock" vulnerability Monday, though it says only "advanced UNIX users" of OS X need it. Video provided by Newsy
Powered by NewsLook.com
Do Video Games Trump Brain Training For Cognitive Boosts?

Do Video Games Trump Brain Training For Cognitive Boosts?

Newsy (Sep. 29, 2014) More and more studies are showing positive benefits to playing video games, but the jury is still out on brain training programs. Video provided by Newsy
Powered by NewsLook.com
New Facebook Ad Platform Goes Where You Go On The Web

New Facebook Ad Platform Goes Where You Go On The Web

Newsy (Sep. 29, 2014) Called Atlas, the platform allows advertisers to place ads based on Facebook info on sites outside of Facebook. Video provided by Newsy
Powered by NewsLook.com
Google Tightens Requirements For Android Manufacturers

Google Tightens Requirements For Android Manufacturers

Newsy (Sep. 27, 2014) Phonemakers who want to use Google’s software in their devices will have to stick to more stringent requirements. Video provided by Newsy
Powered by NewsLook.com

Search ScienceDaily

Number of stories in archives: 140,361

Find with keyword(s):
Enter a keyword or phrase to search ScienceDaily for related topics and research stories.

Save/Print:
Share:

Breaking News:

Strange & Offbeat Stories


Space & Time

Matter & Energy

Computers & Math

In Other News

... from NewsDaily.com

Science News

Health News

Environment News

Technology News



Save/Print:
Share:

Free Subscriptions


Get the latest science news with ScienceDaily's free email newsletters, updated daily and weekly. Or view hourly updated newsfeeds in your RSS reader:

Get Social & Mobile


Keep up to date with the latest news from ScienceDaily via social networks and mobile apps:

Have Feedback?


Tell us what you think of ScienceDaily -- we welcome both positive and negative comments. Have any problems using the site? Questions?
Mobile: iPhone Android Web
Follow: Facebook Twitter Google+
Subscribe: RSS Feeds Email Newsletters
Latest Headlines Health & Medicine Mind & Brain Space & Time Matter & Energy Computers & Math Plants & Animals Earth & Climate Fossils & Ruins