Featured Research

from universities, journals, and other organizations

Significant Process In Creating 3D Stacked Integrated Chips

Date:
October 14, 2008
Source:
Interuniversity Microelectronics Centre (IMEC)
Summary:
A nanoelectronics research institute has announced that it has made significant progress with its 3D-SIC (3D stacked IC) technology. Scientists recently demonstrated the first functional 3D integrated circuits obtained by die-to-die stacking using 5m Cu through-silicon vias (TSV). The next step is to further develop 3D SIC chips on 200mm and 300mm wafers.

Test-chip taped for assessing design rules and models for 3D-SIC technology. J
Credit: IMEC

IMEC, Europe’s leading independent nanoelectronics research institute has announced that it has made significant progress with its 3D-SIC (3D stacked IC) technology. IMEC recently demonstrated the first functional 3D integrated circuits obtained by die-to-die stacking using 5m Cu through-silicon vias (TSV).

Related Articles


It will now further develop 3D SIC chips on 200mm and 300mm wafers, integrating test circuits from partners participating in its 3D integration research program.

IMEC reported a first-time demonstration of 3D integrated circuits obtained by die-to-die stacking and using 5m Cu through-silicon vias (TSV). The dies were realized on 200mm wafers in IMEC’s reference 0.13m CMOS process with an added Cu-TSVs process. For stacking, the top die was thinned down to 25m and bonded to the landing die by Cu-Cu thermocompression. IMEC is upscaling the process for die-to-wafer bonding and is on track for migrating the process to its 300mm platform.

To evaluate the impact of the 3D SIC flow on the characteristics of the stacked layers, both the top and landing wafers contained CMOS circuits. Extensive tests confirmed that the performance of the circuits does not degrade with adding Cu TSVs and stacking. And to test the integrity and performance of the 3D stack, ring oscillators with varying configurations were made, distributed over the two chip layers and connected with the Cu TSVs. Tested after the TSV and stacking process, these circuits demonstrated the chips excellent integrity.

“With these tests, we have demonstrated that our technology allows designing and fabricating fully functional 3D SIC chips. We are now ready to accept reference test circuits from our industry partners,” commented Eric Beyne, IMEC Scientific Director for 3D Technologies, “This will enable the industry to gain early insight and experience with 3D SIC design, using their own designs”.


Story Source:

The above story is based on materials provided by Interuniversity Microelectronics Centre (IMEC). Note: Materials may be edited for content and length.


Cite This Page:

Interuniversity Microelectronics Centre (IMEC). "Significant Process In Creating 3D Stacked Integrated Chips." ScienceDaily. ScienceDaily, 14 October 2008. <www.sciencedaily.com/releases/2008/10/081013125723.htm>.
Interuniversity Microelectronics Centre (IMEC). (2008, October 14). Significant Process In Creating 3D Stacked Integrated Chips. ScienceDaily. Retrieved October 25, 2014 from www.sciencedaily.com/releases/2008/10/081013125723.htm
Interuniversity Microelectronics Centre (IMEC). "Significant Process In Creating 3D Stacked Integrated Chips." ScienceDaily. www.sciencedaily.com/releases/2008/10/081013125723.htm (accessed October 25, 2014).

Share This



More Matter & Energy News

Saturday, October 25, 2014

Featured Research

from universities, journals, and other organizations


Featured Videos

from AP, Reuters, AFP, and other news services

IKEA Desk Converts From Standing to Sitting With One Button

IKEA Desk Converts From Standing to Sitting With One Button

Buzz60 (Oct. 24, 2014) IKEA is out with a new convertible desk that can convert from a sitting desk to a standing one with just the push of a button. Jen Markham explains. Video provided by Buzz60
Powered by NewsLook.com
Ebola Protective Suits Being Made in China

Ebola Protective Suits Being Made in China

AFP (Oct. 24, 2014) A factory in China is busy making Ebola protective suits for healthcare workers and others fighting the spread of the virus. Duration: 00:38 Video provided by AFP
Powered by NewsLook.com
Real-Life Transformer Robot Walks, Then Folds Into a Car

Real-Life Transformer Robot Walks, Then Folds Into a Car

Buzz60 (Oct. 24, 2014) Brave Robotics and Asratec teamed with original Transformers toy company Tomy to create a functional 5-foot-tall humanoid robot that can march and fold itself into a 3-foot-long sports car. Jen Markham has the story. Video provided by Buzz60
Powered by NewsLook.com
Police Testing New Gunfire Tracking Technology

Police Testing New Gunfire Tracking Technology

AP (Oct. 24, 2014) A California-based startup has designed new law enforcement technology that aims to automatically alert dispatch when an officer's gun is unholstered and fired. Two law enforcement agencies are currently testing the technology. (Oct. 24) Video provided by AP
Powered by NewsLook.com

Search ScienceDaily

Number of stories in archives: 140,361

Find with keyword(s):
Enter a keyword or phrase to search ScienceDaily for related topics and research stories.

Save/Print:
Share:

Breaking News:

Strange & Offbeat Stories


Space & Time

Matter & Energy

Computers & Math

In Other News

... from NewsDaily.com

Science News

Health News

Environment News

Technology News



Save/Print:
Share:

Free Subscriptions


Get the latest science news with ScienceDaily's free email newsletters, updated daily and weekly. Or view hourly updated newsfeeds in your RSS reader:

Get Social & Mobile


Keep up to date with the latest news from ScienceDaily via social networks and mobile apps:

Have Feedback?


Tell us what you think of ScienceDaily -- we welcome both positive and negative comments. Have any problems using the site? Questions?
Mobile: iPhone Android Web
Follow: Facebook Twitter Google+
Subscribe: RSS Feeds Email Newsletters
Latest Headlines Health & Medicine Mind & Brain Space & Time Matter & Energy Computers & Math Plants & Animals Earth & Climate Fossils & Ruins