Featured Research

from universities, journals, and other organizations

Significant Process In Creating 3D Stacked Integrated Chips

Date:
October 14, 2008
Source:
Interuniversity Microelectronics Centre (IMEC)
Summary:
A nanoelectronics research institute has announced that it has made significant progress with its 3D-SIC (3D stacked IC) technology. Scientists recently demonstrated the first functional 3D integrated circuits obtained by die-to-die stacking using 5m Cu through-silicon vias (TSV). The next step is to further develop 3D SIC chips on 200mm and 300mm wafers.

Test-chip taped for assessing design rules and models for 3D-SIC technology. J
Credit: IMEC

IMEC, Europe’s leading independent nanoelectronics research institute has announced that it has made significant progress with its 3D-SIC (3D stacked IC) technology. IMEC recently demonstrated the first functional 3D integrated circuits obtained by die-to-die stacking using 5m Cu through-silicon vias (TSV).

Related Articles


It will now further develop 3D SIC chips on 200mm and 300mm wafers, integrating test circuits from partners participating in its 3D integration research program.

IMEC reported a first-time demonstration of 3D integrated circuits obtained by die-to-die stacking and using 5m Cu through-silicon vias (TSV). The dies were realized on 200mm wafers in IMEC’s reference 0.13m CMOS process with an added Cu-TSVs process. For stacking, the top die was thinned down to 25m and bonded to the landing die by Cu-Cu thermocompression. IMEC is upscaling the process for die-to-wafer bonding and is on track for migrating the process to its 300mm platform.

To evaluate the impact of the 3D SIC flow on the characteristics of the stacked layers, both the top and landing wafers contained CMOS circuits. Extensive tests confirmed that the performance of the circuits does not degrade with adding Cu TSVs and stacking. And to test the integrity and performance of the 3D stack, ring oscillators with varying configurations were made, distributed over the two chip layers and connected with the Cu TSVs. Tested after the TSV and stacking process, these circuits demonstrated the chips excellent integrity.

“With these tests, we have demonstrated that our technology allows designing and fabricating fully functional 3D SIC chips. We are now ready to accept reference test circuits from our industry partners,” commented Eric Beyne, IMEC Scientific Director for 3D Technologies, “This will enable the industry to gain early insight and experience with 3D SIC design, using their own designs”.


Story Source:

The above story is based on materials provided by Interuniversity Microelectronics Centre (IMEC). Note: Materials may be edited for content and length.


Cite This Page:

Interuniversity Microelectronics Centre (IMEC). "Significant Process In Creating 3D Stacked Integrated Chips." ScienceDaily. ScienceDaily, 14 October 2008. <www.sciencedaily.com/releases/2008/10/081013125723.htm>.
Interuniversity Microelectronics Centre (IMEC). (2008, October 14). Significant Process In Creating 3D Stacked Integrated Chips. ScienceDaily. Retrieved October 31, 2014 from www.sciencedaily.com/releases/2008/10/081013125723.htm
Interuniversity Microelectronics Centre (IMEC). "Significant Process In Creating 3D Stacked Integrated Chips." ScienceDaily. www.sciencedaily.com/releases/2008/10/081013125723.htm (accessed October 31, 2014).

Share This



More Matter & Energy News

Friday, October 31, 2014

Featured Research

from universities, journals, and other organizations


Featured Videos

from AP, Reuters, AFP, and other news services

Jaguar Land Rover Opens $800 Million Factory in Britain

Jaguar Land Rover Opens $800 Million Factory in Britain

AFP (Oct. 30, 2014) British luxury car manufacturer Jaguar Land Rover opened a $800 million engine manufacturing centre in western England, creating 1,400 jobs. Duration: 00:45 Video provided by AFP
Powered by NewsLook.com
SkyCruiser Concept Claims to Solve Problem With Flying Cars

SkyCruiser Concept Claims to Solve Problem With Flying Cars

Buzz60 (Oct. 30, 2014) A start-up company called Krossblade says its SkyCruiser concept flying car solves the problem with most flying car concepts. Mara Montalbano (@maramontalbano) explains. Video provided by Buzz60
Powered by NewsLook.com
Mind-Controlled Prosthetic Arm Restores Amputee Dexterity

Mind-Controlled Prosthetic Arm Restores Amputee Dexterity

Reuters - Innovations Video Online (Oct. 29, 2014) A Swedish amputee who became the first person to ever receive a brain controlled prosthetic arm is able to manipulate and handle delicate objects with an unprecedented level of dexterity. The device is connected directly to his bone, nerves and muscles, giving him the ability to control it with his thoughts. Matthew Stock reports. Video provided by Reuters
Powered by NewsLook.com
Robots Get Funky on the Dance Floor

Robots Get Funky on the Dance Floor

AP (Oct. 29, 2014) Dancing, spinning and fighting robots are showing off their agility at "Robocomp" in Krakow. (Oct. 29) Video provided by AP
Powered by NewsLook.com

Search ScienceDaily

Number of stories in archives: 140,361

Find with keyword(s):
Enter a keyword or phrase to search ScienceDaily for related topics and research stories.

Save/Print:
Share:

Breaking News:

Strange & Offbeat Stories


Space & Time

Matter & Energy

Computers & Math

In Other News

... from NewsDaily.com

Science News

Health News

Environment News

Technology News



Save/Print:
Share:

Free Subscriptions


Get the latest science news with ScienceDaily's free email newsletters, updated daily and weekly. Or view hourly updated newsfeeds in your RSS reader:

Get Social & Mobile


Keep up to date with the latest news from ScienceDaily via social networks and mobile apps:

Have Feedback?


Tell us what you think of ScienceDaily -- we welcome both positive and negative comments. Have any problems using the site? Questions?
Mobile: iPhone Android Web
Follow: Facebook Twitter Google+
Subscribe: RSS Feeds Email Newsletters
Latest Headlines Health & Medicine Mind & Brain Space & Time Matter & Energy Computers & Math Plants & Animals Earth & Climate Fossils & Ruins