Featured Research

from universities, journals, and other organizations

Ultra-thin solar blind extreme ultraviolet imager developed

Date:
December 8, 2010
Source:
Interuniversity Microelectronics Centre (IMEC)
Summary:
Researchers have developed an ultra-thin hybrid AlGaN-on-Si-based extreme ultraviolet (EUV) imager with only 10m pixel-to-pixel pitch. The wide-bandgap material (AlGaN) provides insensitivity to visible wavelengths and enhanced UV radiation hardness compared to silicon. Backside illumination in a hybrid design was used to achieve a very small pitch-to-pitch (10m only). The novel imager shows an excellent detection down to a wavelength of 1nm.

At the International Electron Devices Meeting in San Francisco, researchers with Imec presented an ultra-thin hybrid AlGaN-on-Si-based extreme ultraviolet (EUV) imager with only 10m pixel-to-pixel pitch. The wide-bandgap material (AlGaN) provides insensitivity to visible wavelengths and enhanced UV radiation hardness compared to silicon. Backside illumination in a hybrid design was used to achieve a very small pitch-to-pitch (10m only). The novel imager shows an excellent detection down to a wavelength of 1nm.

Ultraviolet detection is of particular interest for solar science, EUV microscopy and advanced EUV lithography tools. Sensors using wide-bandgap materials overcome the drawbacks of Si-based sensors such as their sensitivity to UV radiation damage and the need for filters to block the unnecessary visible and infrared radiation.

Imec's backside illuminated EUV imager is based on a state-of-the-art hybrid design integrating an AlGaN sensor on a silicon readout chip. A submicron thick AlGaN layer was grown on a Si(111) wafer using molecular beam epitaxy and a focal plane array of 256x256 pixels with a pixel-to-pixel pitch of 10 micron was processed. Each pixel contains a Schottky diode optimized for backside illumination. A custom read-out chip, based on capacitance transimpedance amplifiers, was fabricated in 0.35m CMOS technology. The AlGaN wafer and read-out chip were post-processed with indium solder bumps with 10m pixel-to-pixel pitch achieving excellent uniformity. The focal plane array and read-out chip were assembled using flip-chip bonding and subsequently the silicon substrate was locally removed to enable backside illumination of the active AlGaN layer. Finally, the imager was packaged and wire-bonded. Measurements demonstrated an excellent response down to a wavelength of 1nm.

These results were obtained in collaboration with CRHEA/CNRS (France) and the Royal Observatory of Belgium in the framework of the BOLD project of the European Space Agency (ESA).


Story Source:

The above story is based on materials provided by Interuniversity Microelectronics Centre (IMEC). Note: Materials may be edited for content and length.


Cite This Page:

Interuniversity Microelectronics Centre (IMEC). "Ultra-thin solar blind extreme ultraviolet imager developed." ScienceDaily. ScienceDaily, 8 December 2010. <www.sciencedaily.com/releases/2010/12/101208083529.htm>.
Interuniversity Microelectronics Centre (IMEC). (2010, December 8). Ultra-thin solar blind extreme ultraviolet imager developed. ScienceDaily. Retrieved September 18, 2014 from www.sciencedaily.com/releases/2010/12/101208083529.htm
Interuniversity Microelectronics Centre (IMEC). "Ultra-thin solar blind extreme ultraviolet imager developed." ScienceDaily. www.sciencedaily.com/releases/2010/12/101208083529.htm (accessed September 18, 2014).

Share This



More Matter & Energy News

Thursday, September 18, 2014

Featured Research

from universities, journals, and other organizations


Featured Videos

from AP, Reuters, AFP, and other news services

Stocks Hit All-Time High as Fed Holds Steady

Stocks Hit All-Time High as Fed Holds Steady

AP (Sep. 17, 2014) The Federal Reserve signaled Wednesday that it plans to keep a key interest rate at a record low because a broad range of U.S. economic measures remain subpar. Stocks hit an all-time high on the news. (Sept. 17) Video provided by AP
Powered by NewsLook.com
Space Race Pits Bezos Vs Musk

Space Race Pits Bezos Vs Musk

Reuters - Business Video Online (Sep. 16, 2014) Amazon CEO Jeff Bezos' startup will team up with Boeing and Lockheed to develop rocket engines as Elon Musk races to have his rockets certified. Fred Katayama reports. Video provided by Reuters
Powered by NewsLook.com
MIT's Robot Cheetah Unleashed — Can Now Run, Jump Freely

MIT's Robot Cheetah Unleashed — Can Now Run, Jump Freely

Newsy (Sep. 16, 2014) MIT developed a robot modeled after a cheetah. It can run up to speeds of 10 mph, though researchers estimate it will eventually reach 30 mph. Video provided by Newsy
Powered by NewsLook.com
Manufacturer Prints 3-D Car In Record Time

Manufacturer Prints 3-D Car In Record Time

Newsy (Sep. 15, 2014) Automobile manufacturer Local Motors created a drivable electric car using a 3-D printer. Printing the body only took 44 hours. Video provided by Newsy
Powered by NewsLook.com

Search ScienceDaily

Number of stories in archives: 140,361

Find with keyword(s):
Enter a keyword or phrase to search ScienceDaily for related topics and research stories.

Save/Print:
Share:

Breaking News:
from the past week

In Other News

... from NewsDaily.com

Science News

Health News

Environment News

Technology News



Save/Print:
Share:

Free Subscriptions


Get the latest science news with ScienceDaily's free email newsletters, updated daily and weekly. Or view hourly updated newsfeeds in your RSS reader:

Get Social & Mobile


Keep up to date with the latest news from ScienceDaily via social networks and mobile apps:

Have Feedback?


Tell us what you think of ScienceDaily -- we welcome both positive and negative comments. Have any problems using the site? Questions?
Mobile: iPhone Android Web
Follow: Facebook Twitter Google+
Subscribe: RSS Feeds Email Newsletters
Latest Headlines Health & Medicine Mind & Brain Space & Time Matter & Energy Computers & Math Plants & Animals Earth & Climate Fossils & Ruins