Featured Research

from universities, journals, and other organizations

Computer chips: Building upward safely

Date:
March 27, 2013
Source:
The Agency for Science, Technology and Research (A*STAR)
Summary:
A computer model provides important clues for the production of tightly packed electronic components.

A computer model provides important clues for the production of tightly packed electronic components.

Greater numbers of ever-smaller components are required to fit on computer chips to meet the ongoing demands of miniaturizing electronic devices. Consequently, computer chips are becoming increasingly crowded. Designers of electronic architectures have therefore followed the lead of urban planners and started to build upward. In so-called 'three-dimensional (3D) packages', for example, several flat, two-dimensional chips can be stacked on top of each other using vertical joints.

Controlling the properties of these complex structures is no easy task, as many factors come into play during production. Faxing Che and Hongyu Li and co-workers from the A*STAR Institute of Microelectronics, Singapore, have now developed a powerful modeling method that allows large-scale simulations -- and optimization -- of the fabrication process, which provides welcome assistance to designers.

Among the challenges of producing tightly packed computer chips is the need to prevent warpage of the underlying silicon wafer as electronics components are stacked on it. Warpage leads to a number of unwanted effects. "Strong warpage can cause wafer breakage, it makes tight packing more difficult and some processing machines cannot handle high-warpage wafers," explains Li. The degree of warpage depends on many design and process parameters, and optimizing the procedure experimentally is time-consuming and costly.

Using their computer model, Che and Li studied a wide range of parameters that influence the warpage of an 8-inch diameter silicon wafer. They focused, in particular, on how a silicon substrate responds to the deposition of layers of copper -- through which electrical currents eventually flow. "This is the first time that a model has been able to predict warpage [at] the level of the entire wafer," says Li. Moreover, the stress on the wafer can be determined accurately. The calculated values agreed well with experimental data. Importantly, with the computer simulations, the researchers could explore regimes that cannot be easily studied experimentally, such as how the depth of the connections between layers influences wafer warpage.

The next goal is to simulate even larger wafers with variable connection sizes, explains Li. "Today, there are two industry standards for 3D packaging applications, 8-inch and 12-inch wafers, but the latter are becoming increasingly important," she says. The team's model is applicable to these larger wafers, too, but it requires optimization. Currently, Che, Li and their co-workers are collecting warpage and stress data for 12-inch wafers. They will use these data for developing their model further, according to Li.

The A*STAR-affiliated researchers contributing to this research are from the Institute of Microelectronics


Story Source:

The above story is based on materials provided by The Agency for Science, Technology and Research (A*STAR). Note: Materials may be edited for content and length.


Journal Reference:

  1. Faxing Che, Hongyu Y. Li, Xiaowu Zhang, Shan Gao, Kenghwa H. Teo. Development of Wafer-Level Warpage and Stress Modeling Methodology and Its Application in Process Optimization for TSV Wafers. IEEE Transactions on Components, Packaging and Manufacturing Technology, 2012; 2 (6): 944 DOI: 10.1109/TCPMT.2012.2192732

Cite This Page:

The Agency for Science, Technology and Research (A*STAR). "Computer chips: Building upward safely." ScienceDaily. ScienceDaily, 27 March 2013. <www.sciencedaily.com/releases/2013/03/130327162352.htm>.
The Agency for Science, Technology and Research (A*STAR). (2013, March 27). Computer chips: Building upward safely. ScienceDaily. Retrieved July 24, 2014 from www.sciencedaily.com/releases/2013/03/130327162352.htm
The Agency for Science, Technology and Research (A*STAR). "Computer chips: Building upward safely." ScienceDaily. www.sciencedaily.com/releases/2013/03/130327162352.htm (accessed July 24, 2014).

Share This




More Computers & Math News

Thursday, July 24, 2014

Featured Research

from universities, journals, and other organizations


Featured Videos

from AP, Reuters, AFP, and other news services

Robot Parking Valet Creates Stress-Free Travel

Robot Parking Valet Creates Stress-Free Travel

AP (July 23, 2014) 'Ray' the robotic parking valet at Dusseldorf Airport in Germany lets travelers to avoid the hassle of finding a parking spot before heading to the check-in desk. (July 23) Video provided by AP
Powered by NewsLook.com
Six Indicted in StubHub Hacking Scheme

Six Indicted in StubHub Hacking Scheme

AP (July 23, 2014) Six people were indicted Wednesday in an international ring that took over more than 1,000 StubHub users' accounts and fraudulently bought tickets that were then resold. (July 23) Video provided by AP
Powered by NewsLook.com
The Reviews Are In For The Amazon Fire Phone

The Reviews Are In For The Amazon Fire Phone

Newsy (July 23, 2014) Amazon's first smartphone, the Fire Phone, is set to ship this week, and so far the reviews have been pretty mixed. Video provided by Newsy
Powered by NewsLook.com
Bigger Apple Phone, Bigger Orders

Bigger Apple Phone, Bigger Orders

Reuters - Business Video Online (July 22, 2014) Apple is asking suppliers to make 70 to 80 million units of its new larger screen iPhone, a lot more initially than its current model. Fred Katayama reports. Video provided by Reuters
Powered by NewsLook.com

Search ScienceDaily

Number of stories in archives: 140,361

Find with keyword(s):
Enter a keyword or phrase to search ScienceDaily for related topics and research stories.

Save/Print:
Share:

Breaking News:
from the past week

In Other News

... from NewsDaily.com

Science News

Health News

Environment News

Technology News



Save/Print:
Share:

Free Subscriptions


Get the latest science news with ScienceDaily's free email newsletters, updated daily and weekly. Or view hourly updated newsfeeds in your RSS reader:

Get Social & Mobile


Keep up to date with the latest news from ScienceDaily via social networks and mobile apps:

Have Feedback?


Tell us what you think of ScienceDaily -- we welcome both positive and negative comments. Have any problems using the site? Questions?
Mobile: iPhone Android Web
Follow: Facebook Twitter Google+
Subscribe: RSS Feeds Email Newsletters
Latest Headlines Health & Medicine Mind & Brain Space & Time Matter & Energy Computers & Math Plants & Animals Earth & Climate Fossils & Ruins